DILB28P-223TLF

DILB28P-223TLF

Manufacturer

Storage & Server IO (Amphenol ICC)

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET 28POS TIN

Specifications

  • Series
    -
  • Package
    Tube
  • Part Status
    Active
  • Type
    DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid)
    28 (2 x 14)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Tin
  • Contact Finish Thickness - Mating
    100.0µin (2.54µm)
  • Contact Material - Mating
    Copper Alloy
  • Mounting Type
    Through Hole
  • Features
    Open Frame
  • Termination
    Solder
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Tin
  • Contact Finish Thickness - Post
    100.0µin (2.54µm)
  • Contact Material - Post
    Copper Alloy
  • Housing Material
    Polyamide (PA), Nylon
  • Operating Temperature
    -55°C ~ 105°C

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In Stock 23657
Quantity:
Unit Price (Reference Price):
0.44000
Target price:
Total:0.44000

Datasheet