DIP316-011BLF

DIP316-011BLF

Manufacturer

Storage & Server IO (Amphenol ICC)

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET 16POS GOLD

Specifications

  • Series
    -
  • Package
    Tube
  • Part Status
    Obsolete
  • Type
    DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid)
    16 (2 x 8)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Gold
  • Contact Finish Thickness - Mating
    10.0µin (0.25µm)
  • Contact Material - Mating
    Beryllium Copper
  • Mounting Type
    Through Hole
  • Features
    Open Frame
  • Termination
    Solder
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Tin
  • Contact Finish Thickness - Post
    200.0µin (5.08µm)
  • Contact Material - Post
    Brass
  • Housing Material
    Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature
    -

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