08-2513-10

08-2513-10

Manufacturer

Aries Electronics, Inc.

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET 8POS GOLD

Specifications

  • Series
    Lo-PRO®file, 513
  • Package
    Bulk
  • Part Status
    Active
  • Type
    DIP, 0.2" (5.08mm) Row Spacing
  • Number of Positions or Pins (Grid)
    8 (2 x 4)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Gold
  • Contact Finish Thickness - Mating
    10.0µin (0.25µm)
  • Contact Material - Mating
    Beryllium Copper
  • Mounting Type
    Through Hole
  • Features
    Closed Frame
  • Termination
    Solder
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Tin
  • Contact Finish Thickness - Post
    200.0µin (5.08µm)
  • Contact Material - Post
    Brass
  • Housing Material
    Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature
    -55°C ~ 105°C

08-2513-10 Request a Quote

In Stock 14497
Quantity:
Unit Price (Reference Price):
1.47000
Target price:
Total:1.47000

Datasheet