Specifications

• Series
  518
• Package
  Bulk
• Part Status
  Active
• Type
  SIP
• Number of Positions or Pins (Grid)
  20 (1 x 20)
• Pitch - Mating
  0.100" (2.54mm)
• Contact Finish - Mating
  Gold
• Contact Finish Thickness - Mating
  10.0µin (0.25µm)
• Contact Material - Mating
  Beryllium Copper
• Mounting Type
  Through Hole
• Features
  Open Frame
• Termination
  Solder
• Pitch - Post
  0.100" (2.54mm)
• Contact Finish - Post
  Tin
• Contact Finish Thickness - Post
  200.0µin (5.08µm)
• Contact Material - Post
  Brass
• Housing Material
  Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature
  -