Specifications

• Series
  55
• Package
  Bulk
• Part Status
  Active
• Type
  DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid)
  28 (2 x 14)
• Pitch - Mating
  0.100" (2.54mm)
• Contact Finish - Mating
  Nickel Boron
• Contact Finish Thickness - Mating
  50.0µin (1.27µm)
• Contact Material - Mating
  Beryllium Nickel
• Mounting Type
  Through Hole
• Features
  Closed Frame
• Termination
  Solder
• Pitch - Post
  0.100" (2.54mm)
• Contact Finish - Post
  Nickel Boron
• Contact Finish Thickness - Post
  50.0µin (1.27µm)
• Contact Material - Post
  Beryllium Nickel
• Housing Material
  Polyetheretherketone (PEEK), Glass Filled
• Operating Temperature
  -55°C ~ 250°C