40-6574-10

40-6574-10

Manufacturer

Aries Electronics, Inc.

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET ZIF 40POS TIN

Specifications

  • Series
    57
  • Package
    Bulk
  • Part Status
    Active
  • Type
    DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid)
    40 (2 x 20)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Tin
  • Contact Finish Thickness - Mating
    200.0µin (5.08µm)
  • Contact Material - Mating
    Beryllium Copper
  • Mounting Type
    Through Hole
  • Features
    Closed Frame
  • Termination
    Solder
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Tin
  • Contact Finish Thickness - Post
    200.0µin (5.08µm)
  • Contact Material - Post
    Beryllium Copper
  • Housing Material
    Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature
    -

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In Stock 3662
Quantity:
Unit Price (Reference Price):
18.31000
Target price:
Total:18.31000

Datasheet