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BGA0011
Manufacturer
Product Category
Description
BGA-25 TO DIP-25 SMT ADAPTER
RFQ Email: [email protected] or Inquires online
Specifications
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SeriesProto-Advantage
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PackageBulk
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Part StatusActive
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Proto Board TypeSMD to DIP
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Package AcceptedBGA
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Number of Positions25
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Pitch0.020" (0.50mm)
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Board Thickness0.062" (1.57mm) 1/16"
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MaterialFR4 Epoxy Glass
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Size / Dimension0.700" x 1.300" (17.78mm x 33.02mm)
