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BGA0030
Manufacturer
Product Category
Description
BGA-36 TO DIP-36 SMT ADAPTER (0.
RFQ Email: [email protected] or Inquires online
Specifications
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SeriesProto-Advantage
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PackageBulk
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Part StatusActive
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Proto Board TypeSMD to DIP
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Package AcceptedBGA
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Number of Positions36
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Pitch0.020" (0.50mm)
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Board Thickness0.063" (1.60mm)
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MaterialFR4 Epoxy Glass
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Size / Dimension0.700" L x 1.800" W (17.78mm x 45.72mm)
