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IPC0184
Manufacturer
Product Category
Description
POWERPAD-24/POWERSOIC-24 TO DIP-
RFQ Email: [email protected] or Inquires online
Specifications
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SeriesProto-Advantage
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PackageBulk
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Part StatusActive
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Proto Board TypeSMD to DIP
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Package AcceptedPowerSOIC
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Number of Positions24
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Pitch0.050" (1.27mm)
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Board Thickness0.063" (1.60mm)
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MaterialFR4 Epoxy Glass
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Size / Dimension1.000" L x 1.400" W (25.40mm x 35.56mm)
