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PA0038
Manufacturer
Product Category
Description
TSSOP-30 TO DIP-30 SMT ADAPTER
RFQ Email: [email protected] or Inquires online
Specifications
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SeriesProto-Advantage
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PackageBulk
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Part StatusActive
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Proto Board TypeSMD to DIP
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Package AcceptedTSSOP
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Number of Positions30
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Pitch0.020" (0.50mm)
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Board Thickness0.062" (1.57mm) 1/16"
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MaterialFR4 Epoxy Glass
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Size / Dimension1.000" x 1.600" (25.40mm x 40.64mm)
