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PA0116
Manufacturer
Product Category
Description
CSP-24/UCSP-24 TO DIP-24 SMT
RFQ Email: [email protected] or Inquires online
Specifications
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SeriesProto-Advantage
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PackageBulk
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Part StatusActive
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Proto Board TypeSMD to DIP
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Package AcceptedCSP, UCSP
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Number of Positions24
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Pitch0.020" (0.50mm)
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Board Thickness0.062" (1.57mm) 1/16"
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MaterialFR4 Epoxy Glass
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Size / Dimension0.700" x 1.200" (17.78mm x 30.48mm)
