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PA0191
Manufacturer
Product Category
Description
TSSOP-10-EXP-PAD TO DIP-10 SMT
RFQ Email: [email protected] or Inquires online
Specifications
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SeriesProto-Advantage
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PackageBulk
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Part StatusActive
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Proto Board TypeSMD to DIP
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Package AcceptedTSSOP
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Number of Positions10
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Pitch0.020" (0.50mm)
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Board Thickness0.062" (1.57mm) 1/16"
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MaterialFR4 Epoxy Glass
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Size / Dimension0.700" x 0.500" (17.78mm x 12.70 mm)
