Specifications

• Series
  -
• Package
  Jar
• Part Status
  Active
• Type
  Solder Paste, Two Part Mix
• Composition
  Sn96.5Ag3Cu0.5 (96.5/3/0.5)
• Diameter
  -
• Melting Point
  423 ~ 428°F (217 ~ 220°C)
• Flux Type
  No-Clean
• Wire Gauge
  -
• Process
  Lead Free
• Form
  Jar, 0.53 oz (15g)
• Shelf Life
  24 Months
• Shelf Life Start
  Date of Manufacture
• Storage/Refrigeration Temperature
  37°F ~ 77°F (3°C ~ 25°C)