SMDLTLFP250T4

SMDLTLFP250T4

Manufacturer

Chip Quik, Inc.

Product Category

Solder

Description

SOLDER PASTE LOW TEMP T4 250G

Specifications

  • Series
    -
  • Package
    Jar
  • Part Status
    Active
  • Type
    Solder Paste
  • Composition
    Bi57.6Sn42Ag0.4 (57.6/42/0.4)
  • Diameter
    -
  • Melting Point
    281°F (138°C)
  • Flux Type
    No-Clean
  • Wire Gauge
    -
  • Process
    Lead Free
  • Form
    Jar, 8.8 oz (250g)
  • Shelf Life
    6 Months
  • Shelf Life Start
    Date of Manufacture
  • Storage/Refrigeration Temperature
    37°F ~ 46°F (3°C ~ 8°C)

SMDLTLFP250T4 Request a Quote

In Stock 1526
Quantity:
Unit Price (Reference Price):
83.95000
Target price:
Total:83.95000

Datasheet