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TC1-200G
Manufacturer
Product Category
Thermal - Adhesives, Epoxies, Greases, Pastes
Description
HEAT SINK COMPOUND - HIGH DENSIT
RFQ Email: [email protected] or Inquires online
Specifications
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Series-
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PackageBulk
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Part StatusActive
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TypeSilicone Compound
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Size / Dimension200 gram Jar
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Usable Temperature Range-
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ColorWhite
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Thermal Conductivity0.67W/m-K
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Features-
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Shelf Life60 Months
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Storage/Refrigeration Temperature37°F ~ 77°F (3°C ~ 25°C)
