TS391SNL10

TS391SNL10

Manufacturer

Chip Quik, Inc.

Product Category

Solder

Description

THERMALLY STABLE SOLDER PASTE NO

Specifications

  • Series
    -
  • Package
    Bulk
  • Part Status
    Active
  • Type
    Solder Paste
  • Composition
    Sn96.5Ag3Cu0.5 (96.5/3/0.5)
  • Diameter
    -
  • Melting Point
    423 ~ 428°F (217 ~ 220°C)
  • Flux Type
    No-Clean
  • Wire Gauge
    -
  • Process
    Lead Free
  • Form
    Syringe, 1.23 oz (35g), 10cc
  • Shelf Life
    12 Months
  • Shelf Life Start
    Date of Manufacture
  • Storage/Refrigeration Temperature
    68°F ~ 77°F (20°C ~ 25°C)

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In Stock 2558
Quantity:
Unit Price (Reference Price):
31.95000
Target price:
Total:31.95000

Datasheet