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TS991SNL500T4
RFQ Email: [email protected] or Inquires online
Specifications
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SeriesCHIPQUIK®
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PackageBulk
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Part StatusActive
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TypeSolder Paste
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CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
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Diameter-
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Melting Point423°F (217°C)
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Flux TypeNo-Clean
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Wire Gauge-
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ProcessLeaded
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FormJar, 17.64 oz (500g)
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Shelf Life12 Months
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Shelf Life StartDate of Manufacture
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Storage/Refrigeration Temperature-
