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Specifications
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SeriesR500
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PackageBulk
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Part StatusActive
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TypeSolder Paste
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CompositionSn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
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Diameter-
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Melting Point423 ~ 424°F (217 ~ 218°C)
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Flux TypeWater Soluble
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Wire Gauge-
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ProcessLead Free
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FormSyringe, 1.23 oz (35g), 10cc
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Shelf Life6 Months
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Shelf Life StartDate of Manufacture
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Storage/Refrigeration Temperature32°F ~ 50°F (0°C ~ 10°C)
