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0C97043802
Manufacturer
Product Category
RFI and EMI - Contacts, Fingerstock and Gaskets
Description
RFI EMI GROUNDING MATERIAL 25FT
RFQ Email: [email protected] or Inquires online
Specifications
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SeriesLarge Enclosure
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PackageBulk
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Part StatusActive
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TypeFingerstock
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Shape-
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Width1.090" (27.69mm)
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Length25.000' (7.62m)
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Height0.250" (6.35mm)
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MaterialBeryllium Copper
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Plating-
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Plating - Thickness-
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Attachment MethodHardware, Rivet, Solder
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Operating Temperature121°C
