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4900P-250G
RFQ Email: [email protected] or Inquires online
Specifications
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Series4900
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PackageBulk
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Part StatusActive
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TypeSolder Paste
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CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
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Diameter-
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Melting Point423 ~ 430°F (217 ~ 221°C)
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Flux TypeNo-Clean
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Wire Gauge-
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ProcessLead Free
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FormJar, 8.8 oz (250g)
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Shelf Life24 Months
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Shelf Life StartDate of Manufacture
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Storage/Refrigeration Temperature35°F ~ 50°F (2°C ~ 10°C)
