XR2A-1611-N

XR2A-1611-N

Manufacturer

Omron Electronics Components

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET 16POS GOLD

Specifications

  • Series
    XR2
  • Package
    Bulk
  • Part Status
    Active
  • Type
    DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid)
    16 (2 x 8)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Gold
  • Contact Finish Thickness - Mating
    10.0µin (0.25µm)
  • Contact Material - Mating
    Beryllium Copper
  • Mounting Type
    Through Hole
  • Features
    Open Frame
  • Termination
    Solder
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Gold
  • Contact Finish Thickness - Post
    10.0µin (0.25µm)
  • Contact Material - Post
    Beryllium Copper
  • Housing Material
    Polybutylene Terephthalate (PBT), Glass Filled
  • Operating Temperature
    -55°C ~ 125°C

XR2A-1611-N Request a Quote

In Stock 12995
Quantity:
Unit Price (Reference Price):
2.50000
Target price:
Total:2.50000

Datasheet