BU14OZ-178-HT

BU14OZ-178-HT

Manufacturer

On-Shore Technology, Inc.

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET 14POS GOLD

Specifications

  • Series
    BU-178HT
  • Package
    Tube
  • Part Status
    Active
  • Type
    DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid)
    14 (2 x 7)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Gold
  • Contact Finish Thickness - Mating
    78.7µin (2.00µm)
  • Contact Material - Mating
    Beryllium Copper
  • Mounting Type
    Surface Mount
  • Features
    Open Frame
  • Termination
    Solder
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Copper
  • Contact Finish Thickness - Post
    Flash
  • Contact Material - Post
    Brass
  • Housing Material
    Polybutylene Terephthalate (PBT), Glass Filled
  • Operating Temperature
    -55°C ~ 125°C

BU14OZ-178-HT Request a Quote

In Stock 14470
Quantity:
Unit Price (Reference Price):
1.47000
Target price:
Total:1.47000