Specifications

• Series
  115
• Package
  Bulk
• Part Status
  Active
• Type
  DIP, 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid)
  8 (2 x 4)
• Pitch - Mating
  0.100" (2.54mm)
• Contact Finish - Mating
  Gold
• Contact Finish Thickness - Mating
  Flash
• Contact Material - Mating
  Beryllium Copper
• Mounting Type
  Through Hole
• Features
  Open Frame
• Termination
  Solder
• Pitch - Post
  0.100" (2.54mm)
• Contact Finish - Post
  Tin
• Contact Finish Thickness - Post
  -
• Contact Material - Post
  Brass
• Housing Material
  Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature
  -55°C ~ 125°C