Specifications

• Series
  500
• Package
  Tube
• Part Status
  Active
• Type
  DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid)
  32 (2 x 16)
• Pitch - Mating
  0.100" (2.54mm)
• Contact Finish - Mating
  Gold
• Contact Finish Thickness - Mating
  25.0µin (0.63µm)
• Contact Material - Mating
  Beryllium Copper
• Mounting Type
  Through Hole
• Features
  Closed Frame
• Termination
  Solder
• Pitch - Post
  0.100" (2.54mm)
• Contact Finish - Post
  Gold
• Contact Finish Thickness - Post
  25.0µin (0.63µm)
• Contact Material - Post
  Beryllium Copper
• Housing Material
  Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
• Operating Temperature
  -55°C ~ 125°C