DILB18P-223TLF

DILB18P-223TLF

Manufacturer

Storage & Server IO (Amphenol ICC)

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET 18POS TINLEAD

Specifications

  • Series
    DILB
  • Package
    Tube
  • Part Status
    Active
  • Type
    DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid)
    18 (2 x 9)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Tin-Lead
  • Contact Finish Thickness - Mating
    100.0µin (2.54µm)
  • Contact Material - Mating
    Copper Alloy
  • Mounting Type
    Through Hole
  • Features
    Open Frame
  • Termination
    Solder
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Tin-Lead
  • Contact Finish Thickness - Post
    100.0µin (2.54µm)
  • Contact Material - Post
    Copper Alloy
  • Housing Material
    Polyamide (PA), Nylon
  • Operating Temperature
    -55°C ~ 125°C

DILB18P-223TLF Request a Quote

In Stock 29395
Quantity:
Unit Price (Reference Price):
0.35000
Target price:
Total:0.35000

Datasheet