18-8400-610C

18-8400-610C

Manufacturer

Aries Electronics, Inc.

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET 18POS GOLD

Specifications

  • Series
    8
  • Package
    Bulk
  • Part Status
    Active
  • Type
    DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid)
    18 (2 x 9)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Gold
  • Contact Finish Thickness - Mating
    30.0µin (0.76µm)
  • Contact Material - Mating
    Beryllium Copper
  • Mounting Type
    Through Hole
  • Features
    Closed Frame, Elevated
  • Termination
    Solder
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Gold
  • Contact Finish Thickness - Post
    10.0µin (0.25µm)
  • Contact Material - Post
    Brass
  • Housing Material
    Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature
    -55°C ~ 105°C

18-8400-610C Request a Quote

In Stock 5801
Quantity:
Unit Price (Reference Price):
10.26000
Target price:
Total:10.26000

Datasheet