20-3501-30

20-3501-30

Manufacturer

Aries Electronics, Inc.

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET 20POS TIN

Specifications

  • Series
    501
  • Package
    Bulk
  • Part Status
    Active
  • Type
    DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid)
    20 (2 x 10)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Tin
  • Contact Finish Thickness - Mating
    200.0µin (5.08µm)
  • Contact Material - Mating
    Phosphor Bronze
  • Mounting Type
    Through Hole
  • Features
    Closed Frame
  • Termination
    Wire Wrap
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Tin
  • Contact Finish Thickness - Post
    200.0µin (5.08µm)
  • Contact Material - Post
    Phosphor Bronze
  • Housing Material
    Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature
    -55°C ~ 125°C

20-3501-30 Request a Quote

In Stock 9526
Quantity:
Unit Price (Reference Price):
5.84200
Target price:
Total:5.84200

Datasheet