20-823-90

20-823-90

Manufacturer

Aries Electronics, Inc.

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET 20POS GOLD

Specifications

  • Series
    Vertisockets™ 800
  • Package
    Bulk
  • Part Status
    Active
  • Type
    DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid)
    20 (2 x 10)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Gold
  • Contact Finish Thickness - Mating
    10.0µin (0.25µm)
  • Contact Material - Mating
    Phosphor Bronze
  • Mounting Type
    Through Hole, Right Angle, Horizontal
  • Features
    Closed Frame
  • Termination
    Solder
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Gold
  • Contact Finish Thickness - Post
    10.0µin (0.25µm)
  • Contact Material - Post
    Phosphor Bronze
  • Housing Material
    Polyamide (PA46), Nylon 4/6
  • Operating Temperature
    -

20-823-90 Request a Quote

In Stock 5650
Quantity:
Unit Price (Reference Price):
10.53000
Target price:
Total:10.53000

Datasheet