Specifications

• Series
  6556
• Package
  Bulk
• Part Status
  Active
• Type
  DIP, 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid)
  28 (2 x 14)
• Pitch - Mating
  0.100" (2.54mm)
• Contact Finish - Mating
  Gold
• Contact Finish Thickness - Mating
  30.0µin (0.76µm)
• Contact Material - Mating
  Beryllium Copper
• Mounting Type
  Through Hole
• Features
  Open Frame
• Termination
  Solder Cup
• Pitch - Post
  0.100" (2.54mm)
• Contact Finish - Post
  Gold
• Contact Finish Thickness - Post
  10.0µin (0.25µm)
• Contact Material - Post
  Brass
• Housing Material
  Polyphenylene Sulfide (PPS), Glass Filled
• Operating Temperature
  -