Specifications

• Series
  55
• Package
  Bulk
• Part Status
  Active
• Type
  DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
• Number of Positions or Pins (Grid)
  40 (2 x 20)
• Pitch - Mating
  0.100" (2.54mm)
• Contact Finish - Mating
  Tin
• Contact Finish Thickness - Mating
  200.0µin (5.08µm)
• Contact Material - Mating
  Beryllium Copper
• Mounting Type
  Through Hole
• Features
  Closed Frame
• Termination
  Solder
• Pitch - Post
  0.100" (2.54mm)
• Contact Finish - Post
  Tin
• Contact Finish Thickness - Post
  200.0µin (5.08µm)
• Contact Material - Post
  Beryllium Copper
• Housing Material
  Polyphenylene Sulfide (PPS), Glass Filled
• Operating Temperature
  -