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HF115AC-0.0055-AC-105
Manufacturer
Product Category
Description
THERM PAD 36.83MMX21.29MM W/ADH
RFQ Email: [email protected] or Inquires online
Specifications
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SeriesHi-Flow® 115-AC
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PackageBulk
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Part StatusActive
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UsageSIP
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TypePad, Sheet
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ShapeRectangular
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Outline36.83mm x 21.29mm
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Thickness0.0055" (0.140mm)
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MaterialPhase Change Compound
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AdhesiveAdhesive - One Side
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Backing, CarrierFiberglass
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ColorGray
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Thermal Resistivity0.35°C/W
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Thermal Conductivity0.8W/m-K
