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PA0170
Manufacturer
Product Category
Description
MINI SOIC-8 EXP PAD TO DIP-8 SMT
RFQ Email: [email protected] or Inquires online
Specifications
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SeriesProto-Advantage
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PackageBulk
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Part StatusActive
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Proto Board TypeSMD to DIP
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Package AcceptedMiniSOIC EP
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Number of Positions8
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Pitch0.026" (0.65mm)
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Board Thickness0.062" (1.57mm) 1/16"
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MaterialFR4 Epoxy Glass
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Size / Dimension0.700" x 0.400" (17.78mm x 10.16mm)
