TS391LT

TS391LT

Manufacturer

Chip Quik, Inc.

Product Category

Solder

Description

THERMALLY STABLE SOLDER PASTE NO

Specifications

  • Series
    -
  • Package
    Bulk
  • Part Status
    Active
  • Type
    Solder Paste
  • Composition
    Bi57.6Sn42Ag0.4 (57.6/42/0.4)
  • Diameter
    -
  • Melting Point
    281°F (138°C)
  • Flux Type
    No-Clean
  • Wire Gauge
    -
  • Process
    Lead Free
  • Form
    Syringe, 0.53 oz (15g), 5cc
  • Shelf Life
    12 Months
  • Shelf Life Start
    Date of Manufacture
  • Storage/Refrigeration Temperature
    68°F ~ 77°F (20°C ~ 25°C)

TS391LT Request a Quote

In Stock 3925
Quantity:
Unit Price (Reference Price):
16.95000
Target price:
Total:16.95000

Datasheet