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DE02008
Manufacturer
Product Category
Description
SOP-8/SSOP-8/SOIC-8 TO DIP-8
RFQ Email: [email protected] or Inquires online
Specifications
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Series-
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PackageBag
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Part StatusActive
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Proto Board TypeSMD to DIP
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Package AcceptedSOIC, SOP, SSOP
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Number of Positions8
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Pitch0.100" (2.54mm)
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Board Thickness0.063" (1.60mm)
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MaterialFR4 Epoxy Glass
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Size / Dimension0.433" L x 0.472" W (11.00mm x 12.00mm)
