70-1608-0804

70-1608-0804

Manufacturer

Kester

Product Category

Solder

Description

SOLDER PASTE NO CLEAN 100GM

Specifications

  • Series
    R276
  • Package
    Bulk
  • Part Status
    Active
  • Type
    Solder Paste
  • Composition
    Sn96.5Ag3Cu0.5 (96.5/3/0.5)
  • Diameter
    -
  • Melting Point
    423 ~ 424°F (217 ~ 218°C)
  • Flux Type
    No-Clean
  • Wire Gauge
    -
  • Process
    Lead Free
  • Form
    Syringe, 3.53 oz (100g)
  • Shelf Life
    6 Months
  • Shelf Life Start
    Date of Manufacture
  • Storage/Refrigeration Temperature
    32°F ~ 50°F (0°C ~ 10°C)

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In Stock 1646
Quantity:
Unit Price (Reference Price):
72.16000
Target price:
Total:72.16000

Datasheet