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Specifications
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SeriesNXG1
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PackageBulk
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Part StatusActive
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TypeSolder Paste
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CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
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Diameter-
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Melting Point423 ~ 424°F (217 ~ 218°C)
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Flux TypeNo-Clean
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Wire Gauge-
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ProcessLead Free
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FormJar, 17.64 oz (500g)
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Shelf Life8 Months
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Shelf Life StartDate of Manufacture
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Storage/Refrigeration Temperature32°F ~ 50°F (0°C ~ 10°C)
