ED281DT

ED281DT

Manufacturer

On-Shore Technology, Inc.

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET 28POS TIN

Specifications

  • Series
    ED
  • Package
    Tube
  • Part Status
    Active
  • Type
    DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid)
    28 (2 x 14)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Tin
  • Contact Finish Thickness - Mating
    60.0µin (1.52µm)
  • Contact Material - Mating
    Phosphor Bronze
  • Mounting Type
    Through Hole
  • Features
    Open Frame
  • Termination
    Solder
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Tin
  • Contact Finish Thickness - Post
    60.0µin (1.52µm)
  • Contact Material - Post
    Phosphor Bronze
  • Housing Material
    Polybutylene Terephthalate (PBT), Glass Filled
  • Operating Temperature
    -55°C ~ 110°C

ED281DT Request a Quote

In Stock 30315
Quantity:
Unit Price (Reference Price):
0.34000
Target price:
Total:0.34000

Datasheet