Specifications

• Series
  510
• Package
  Bulk
• Part Status
  Active
• Type
  SIP
• Number of Positions or Pins (Grid)
  10 (1 x 10)
• Pitch - Mating
  0.100" (2.54mm)
• Contact Finish - Mating
  Gold
• Contact Finish Thickness - Mating
  20.0µin (0.51µm)
• Contact Material - Mating
  Beryllium Copper
• Mounting Type
  Through Hole
• Features
  Closed Frame
• Termination
  Solder
• Pitch - Post
  0.100" (2.54mm)
• Contact Finish - Post
  Tin
• Contact Finish Thickness - Post
  20.0µin (0.51µm)
• Contact Material - Post
  Copper
• Housing Material
  Thermoplastic, Polyester
• Operating Temperature
  -