Specifications

• Series
  -
• Package
  Bulk
• Part Status
  Active
• Type
  LGA
• Number of Positions or Pins (Grid)
  2011 (47 x 58)
• Pitch - Mating
  0.040" (1.02mm)
• Contact Finish - Mating
  Gold
• Contact Finish Thickness - Mating
  15.0µin (0.38µm)
• Contact Material - Mating
  Copper Alloy
• Mounting Type
  Surface Mount
• Features
  Open Frame
• Termination
  Solder
• Pitch - Post
  0.035" (0.90mm)
• Contact Finish - Post
  Gold
• Contact Finish Thickness - Post
  15.0µin (0.38µm)
• Contact Material - Post
  Copper Alloy
• Housing Material
  Thermoplastic
• Operating Temperature
  -