508-AG10D

508-AG10D

Manufacturer

TE Connectivity AMP Connectors

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET 8POS GOLD

Specifications

  • Series
    500
  • Package
    Tube
  • Part Status
    Active
  • Type
    DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid)
    8 (2 x 4)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Gold
  • Contact Finish Thickness - Mating
    25.0µin (0.63µm)
  • Contact Material - Mating
    Copper Alloy
  • Mounting Type
    Through Hole
  • Features
    Closed Frame
  • Termination
    Solder
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Gold
  • Contact Finish Thickness - Post
    25.0µin (0.63µm)
  • Contact Material - Post
    Copper Alloy
  • Housing Material
    -
  • Operating Temperature
    -55°C ~ 125°C

508-AG10D Request a Quote

In Stock 7837
Quantity:
Unit Price (Reference Price):
4.33000
Target price:
Total:4.33000

Datasheet