808-AG11D-LF

808-AG11D-LF

Manufacturer

TE Connectivity AMP Connectors

Product Category

Sockets for ICs, Transistors

Description

CONN IC DIP SOCKET 8POS GOLD

Specifications

  • Series
    800
  • Package
    Tube
  • Part Status
    Active
  • Type
    DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid)
    8 (2 x 4)
  • Pitch - Mating
    0.100" (2.54mm)
  • Contact Finish - Mating
    Gold
  • Contact Finish Thickness - Mating
    25.0µin (0.63µm)
  • Contact Material - Mating
    Beryllium Copper
  • Mounting Type
    Through Hole
  • Features
    Open Frame
  • Termination
    Solder
  • Pitch - Post
    0.100" (2.54mm)
  • Contact Finish - Post
    Gold
  • Contact Finish Thickness - Post
    25.0µin (0.63µm)
  • Contact Material - Post
    Copper
  • Housing Material
    Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature
    -55°C ~ 105°C

808-AG11D-LF Request a Quote

In Stock 13056
Quantity:
Unit Price (Reference Price):
1.65000
Target price:
Total:1.65000

Datasheet