Specifications

• Series
  Zynq®-7000
• Package
  Tray
• Part Status
  Active
• Architecture
  MCU, FPGA
• Core Processor
  Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size
  -
• RAM Size
  256KB
• Peripherals
  DMA
• Connectivity
  CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed
  800MHz
• Primary Attributes
  Kintex™-7 FPGA, 350K Logic Cells
• Operating Temperature
  0°C ~ 100°C (TJ)
• Package / Case
  900-BBGA, FCBGA
• Supplier Device Package
  900-FCBGA (31x31)